Coverage Layout Design Rules and Insertion Utilities for CMP-Related Processes
The continuous scaling needed for higher density and better performance has introduced some new challenges to the planarity processes. This has resulted in new definitions of the layout coverage rules developed by the foundry and provided to the designers. In advanced technologies, the set of rules...
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| Principais autores: | , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2020-12-01
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| coleção: | Journal of Low Power Electronics and Applications |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/2079-9268/11/1/2 |
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