Using Heat‐Cool Processing to Change the Assembly and Photoconductive Properties of Perylene Bisimides
Abstract Thermal processing is widely used in solution‐based coating techniques or to enhance solubility, yet the impact on supramolecular self‐assembly and thin film properties remains largely unexplored. Here, we demonstrate how heating and cooling cycles modulate the self‐assembly of amino acid‐a...
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| Asıl Yazarlar: | , , , , , , |
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| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
Wiley-VCH
2025-07-01
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| Seri Bilgileri: | Advanced Materials Interfaces |
| Konular: | |
| Online Erişim: | https://doi.org/10.1002/admi.202500151 |
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