Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer under Various Substrate Bias
This study focuses on the analyses of nano-twinned copper (Cu) films deposited through magnetron sputtering on silicon carbide (SiC) chips. The investigation encompasses the utilization of a chromium (Cr) adhesive layer coupled with varying voltage bias conditions. The goal is to comprehensively exa...
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| Autors principals: | , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2023-10-01
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| Col·lecció: | Metals |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/2075-4701/13/10/1747 |
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