Influence of UnevenTemperature on Current Distribution in Paralleled Multi-Chips Press Pack IGBT
The multi-chip parallel press pack IGBT device is a key component in flexible DC transmission equipment. Due to manufacturing processes, loop parasitic parameters and thermal coupling, the internal stress distribution of the device is imbalance, resulting in uneven aging of the device, the temperatu...
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| Principais autores: | , , , , , , |
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| Formato: | Artigo |
| Idioma: | Chinês |
| Publicado: |
State Grid Energy Research Institute
2020-12-01
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| Series: | Zhongguo dianli |
| Assuntos: | |
| Acceso en liña: | https://www.electricpower.com.cn/CN/10.11930/j.issn.1004-9649.202004065 |
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