The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints
In order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints, this article uses a combination of Transient Liquid Phase Welding and pressure,using foamed copper, pure Sn and Cu substrates as raw materials to prepare IMC-Cu composite micro s...
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| Principais autores: | , , |
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| Formato: | Artigo |
| Idioma: | Chinês |
| Publicado em: |
Harbin University of Science and Technology Publications
2021-12-01
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| coleção: | Journal of Harbin University of Science and Technology |
| Assuntos: | |
| Acesso em linha: | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=2044 |
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