A Study of Low Temperature and Low Stress Electroless Copper Plating Bath
To meet the requirement of PCB copper interconnection, a low temperature and low stress electroless copper plating bath containing Cu(II)-Rochell salt as complex was investigated. The effects of additives, such as 2,6-diaminopyridine as accelerator, 2,2'-dipyridyl as stabilizer, NiSO4·6H2O as stress...
محفوظ في:
| المؤلفون الرئيسيون: | , , , , , |
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| التنسيق: | Artigo |
| اللغة: | Inglês |
| منشور في: |
Elsevier
2013-04-01
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| سلاسل: | International Journal of Electrochemical Science |
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://www.sciencedirect.com/science/article/pii/S1452398123146736 |
| الوسوم: |
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