Application and Development of Smart Thermally Conductive Fiber Materials
In recent years, with the rapid advancement in various high-tech technologies, efficient heat dissipation has become a key issue restricting the further development of high-power-density electronic devices and components. Concurrently, the demand for thermal comfort has increased; making effective p...
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| Autori principali: | , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
MDPI AG
2024-01-01
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| Serie: | Nanomaterials |
| Soggetti: | |
| Accesso online: | https://www.mdpi.com/2079-4991/14/2/154 |
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