Two dimensional confinement induced discontinuous chain transitions for augmented electrocaloric cooling
Abstract Overheating remains a major barrier to chip miniaturization, leading to device malfunction. Addressing the urgent need for thermal management promotes the development of solid-state electrocaloric cooling. However, enhancing passive heat dissipation through two-dimensional materials in elec...
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| Autors principals: | , , , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Nature Portfolio
2025-01-01
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| Col·lecció: | Nature Communications |
| Accés en línia: | https://doi.org/10.1038/s41467-024-55726-5 |
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