Identifying the causes of residual stress in polycrystalline diamond compact (PDC) cutters by X-Ray diffraction technique

An attempt was made to identify the sources of residual stress in polycrystalline diamond compact (PDC) cutters by X-ray diffraction (XRD) technique. PDC retains residual stress after sintering and this residual stress plays an important role for cutter performance. X-ray diffraction method of resid...

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Bibliographic Details

Main Author:	Debkumar Mukhopadhyay
Format:	Artigo
Language:	Inglês
Published:	Elsevier 2021-09-01
Series:	Results in Materials
Subjects:	X-ray diffraction Polycrystalline diamond compact (PDC) cutters High pressure high temperature (HPHT) Residual stress
Online Access:	http://www.sciencedirect.com/science/article/pii/S2590048X21000492
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