Advanced Study of Spray Cooling: From Theories to Applications
With the continuous integration and miniaturization of electronic devices, the heat transfer of the electronic devices continues to surge. This means that thermal management equipment with higher heat flux cooling capacity is required to maintain its normal operation. This paper systematically revie...
Zapisane w:
| Główni autorzy: | , , , , , , , |
|---|---|
| Format: | Artigo |
| Język: | Inglês |
| Wydane: |
MDPI AG
2022-12-01
|
| Seria: | Energies |
| Hasła przedmiotowe: | |
| Dostęp online: | https://www.mdpi.com/1996-1073/15/23/9219 |
| Etykiety: |
Nie ma etykietki, Dołącz pierwszą etykiete!
|