A Semi-Automatic Labeling Framework for PCB Defects via Deep Embeddings and Density-Aware Clustering
(1) Background. Printed circuit board (PCB) inspection is increasingly constrained by the cost and latency of reliable labels, owing to tiny/low-contrast defects embedded in complex backgrounds and severe class imbalance. (2) Methods. We proposed a semi-automatic labeling pipeline that converts anom...
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| Principais autores: | , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
MDPI AG
2025-10-01
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| Series: | Sensors |
| Assuntos: | |
| Acceso en liña: | https://www.mdpi.com/1424-8220/25/20/6470 |
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