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Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine

This study establishes a bidirectional kinematic analysis framework for single-sided chemical mechanical polishing systems through innovative coordinate transformation synergies (rotational and translational). To address three critical gaps in existing research, interaction dynamics for both pad–waf...

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Uloženo v:
Hlavní autoři: Guoqing Ye, Zhenqiang Yao
Médium: Artigo
Jazyk:Inglês
Vydáno: MDPI AG 2025-04-01
Edice:Micromachines
Témata:
trajectory
relative speed
chemical mechanical polishing (CMP)
single-sided polishing machine
silicon wafer
On-line přístup:https://www.mdpi.com/2072-666X/16/4/450
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