Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices
Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si–Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirements of this application (its high-pressure resistance of ~...
Furkejuvvon:
| Váldodahkkit: | , , , , , , , , |
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| Materiálatiipa: | Artigo |
| Giella: | Inglês |
| Almmustuhtton: |
MDPI AG
2023-06-01
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| Ráidu: | Micromachines |
| Fáttát: | |
| Liŋkkat: | https://www.mdpi.com/2072-666X/14/7/1297 |
| Fáddágilkorat: |
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