Advancing the Solidification of Sn–Bi Alloys for Electronic Packaging: Challenges, Progress, and Future Directions
ABSTRACT In the early 2000s, the soldering industry faced a major shift due to regulations restricting Pb usage. As a result, four main alloy systems emerged as alternatives: Sn–Bi, Sn–In, Sn–Cu, and Sn–Ag. However, for reasons not initially evident, higher melting point alloys were the first to be...
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| Hauptverfasser: | , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
Wiley
2025-12-01
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| Schriftenreihe: | MetalMat |
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| Online-Zugang: | https://doi.org/10.1002/metm.70015 |
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