Diffusion bonding of copper alloy and nickel-based superalloy via hot isostatic pressing
Joining copper alloys to nickel-based superalloys can achieve a combination of their advantages. However, joining these two dissimilar alloys is challenging due to their significant differences in properties. In this paper, the advanced hot isostatic pressing-diffusion bonding (HIP-DB) technology wa...
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| Principais autores: | , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Elsevier
2022-07-01
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| coleção: | Journal of Materials Research and Technology |
| Assuntos: | |
| Acesso em linha: | http://www.sciencedirect.com/science/article/pii/S2238785422008134 |
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