Study on Interfacial Bonding Properties of NiTi/CuSn10 Dissimilar Materials by Selective Laser Melting

The dissimilar materials bonding of NiTi alloy with shape memory effect (SME) and CuSn10 alloy with good ductility, electrical conductivity, and thermal conductivity can be used in aerospace, circuits, etc. In order to integrate NiTi and CuSn10 with greatly different physical and chemical properties...

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Detalhes bibliográficos

Principais autores:	Changhui Song, Zehua Hu, Yunmian Xiao, Yang Li, Yongqiang Yang
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2022-03-01
Colecção:	Micromachines
Assuntos:	NiTi alloy CuSn10 alloy selective laser melting dissimilar materials interfacial bonding properties
Acesso em linha:	https://www.mdpi.com/2072-666X/13/4/494
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