The Effect of Tellurium Presence in Anodic Copper on Kinetics and Mechanism of Anodic Dissolution and Cathodic Deposition of Copper
The influence of the presence of tellurium, as an impurity in anode copper, on kinetics, and, on the mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate solution has been investigated. The galvanostatic single-puls method has been used. Results obtained in this study...
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| Autores principales: | , , , , |
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| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
Elsevier
2013-05-01
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| Colección: | International Journal of Electrochemical Science |
| Materias: | |
| Acceso en línea: | http://www.sciencedirect.com/science/article/pii/S1452398123148450 |
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