Effects of temperature and strain rate on tensile properties of (Ag,Cu)-Sn intermetallic compounds: A molecular dynamics study

With the advent of environment friendly microelectronic packaging technologies, the demand of lead-free solders alloy has escalated. Leadfree solder material is an alloy of Tin (Sn), Silver (Ag) and Copper (Cu) and is widely known as SAC solder. Intermetallic compounds (IMC) like Ag3Sn, Cu3Sn and Cu...

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Principais autores:	Md. Maruf Billah, R.I. Siddiquee, Mohammad Motalab, R. Paul, M.S. Rabbi
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Elsevier 2022-05-01
coleção:	Journal of Materials Research and Technology
Assuntos:	Intermetallic compounds Mechanical properties SAC Solder Ag3Sn, Cu3Sn and Cu6Sn5
Acesso em linha:	http://www.sciencedirect.com/science/article/pii/S2238785422004483
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