A low-profile electromechanical packaging system for soft-to-flexible bioelectronic interfaces

Interfacing the human body with the next generation of electronics requires technological advancement in designing and producing bioelectronic circuits. These circuits must integrate electrical functionality while simultaneously addressing limitations in mechanical compliance and dynamics, biocompat...

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Prif Awduron:	Florian Fallegger, Alix Trouillet, Florent-Valéry Coen, Giuseppe Schiavone, Stéphanie P. Lacour
Fformat:	Artigo
Iaith:	Inglês
Cyhoeddwyd:	AIP Publishing LLC 2023-09-01
Cyfres:	APL Bioengineering
Mynediad Ar-lein:	http://dx.doi.org/10.1063/5.0152509
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!