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Investigation of a 4H-SiC Trench MOSFET with Back-Side Super Junction

In this paper, a 4H-SiC trench gate MOSFET, featuring a super junction layer located on the drain-region side, is presented to enhance the breakdown voltage and the figures of merit (FOM). The proposed structure is investigated and compared with the conventional structure with a 2D numerical simulat...

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Autori principali: Lili Zhang, Yuxuan Liu, Junpeng Fang, Yanjuan Liu
Natura: Artigo
Lingua:Inglês
Pubblicazione: MDPI AG 2022-10-01
Serie:Micromachines
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Accesso online:https://www.mdpi.com/2072-666X/13/10/1770
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