Fault modeling, testing, and repair for chiplet interconnects
With the continuous advancement of semiconductor technology, chiplet technology has gained importance due to its significant advantages in enhancing performance, reducing power consumption, and saving space. However, vertical interconnect structures in 3D integrated circuits (ICs), such as through-s...
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| Autori principali: | , , , , , , , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Elsevier
2026-03-01
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| Serie: | Chip |
| Soggetti: | |
| Accesso online: | http://www.sciencedirect.com/science/article/pii/S2709472325000346 |
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