Effect of Grain Size on Nanometric Cutting of Polycrystalline Silicon via Molecular Dynamics Simulation
The grain size effect is an important factor in determining the material removal behavior of polycrystalline silicon (p-Si). In the present study, to improve the understanding of nanoscale machining of p-Si, we performed molecular dynamics simulation of nanometric cutting on a p-Si workpiece and dis...
שמור ב:
| Principais autores: | , , , , , |
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| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
MDPI AG
2024-06-01
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| סדרה: | Micromachines |
| נושאים: | |
| גישה מקוונת: | https://www.mdpi.com/2072-666X/15/6/767 |
| תגים: |
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