Relationship between microstructure and etching performance of 12 μm thick rolled copper foil
12 μm thick rolled copper foil is the thinnest rolled copper foil that can be stably produced at present, which can be used for the production of high-end Flexible Printed Circuit (FPC) boards. With the miniaturized and multi-functional of various electronic components in the age of 5th Generation (...
Gardado en:
| Principais autores: | , , , , , , , |
|---|---|
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
Elsevier
2022-11-01
|
| Series: | Journal of Materials Research and Technology |
| Assuntos: | |
| Acceso en liña: | http://www.sciencedirect.com/science/article/pii/S2238785422015472 |
| Tags: |
Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!
|