High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliabi...

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Hlavní autoři:	Dong Hu, Cheng Qian, Xu Liu, Leiming Du, Zhongchao Sun, Xuejun Fan, Guoqi Zhang, Jiajie Fan
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	Elsevier 2023-09-01
Edice:	Journal of Materials Research and Technology
Témata:	Copper nanoparticles sintering High-temperature tensile test Constitutive modelling Molecular dynamics simulation stochastically equivalent finite element Random void morphology
On-line přístup:	http://www.sciencedirect.com/science/article/pii/S2238785423018987
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