An investigation of methods to enhance adhesion of conductive layer and dielectric substrate for additive manufacturing of electronics
Abstract Additive manufacturing of conductive layers on a dielectric substrate has garnered significant interest due to its promise to produce printed electronics efficiently and its capability to print on curved substrates. A considerable challenge encountered is the conductive layer’s potential pe...
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| Autors principals: | , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Nature Portfolio
2024-05-01
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| Col·lecció: | Scientific Reports |
| Matèries: | |
| Accés en línia: | https://doi.org/10.1038/s41598-024-61327-5 |
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