Construction of novel Cu-α-diimide interactions for enhancing thermal resistance and dimensional stability of polyimide films

The new-generation polyimide films with simultaneously outstanding thermal stability and low coefficient of linear thermal expansion (CTE) are urgently needed. Herein, coordination bonds were employed to improve polyimide films' heat resistance and dimensional stability. Polyimide-Cu complex films w...

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Ngā kaituhi matua:	Senjie Jiang, Zhijun Bi, Junkang Wang, Jiaxin Zhao, Longfei Fan, Liyong Tian, Yancheng Wu, Ningbo Yi, Zhenzhen Wei, Feng Gan
Hōputu:	Artigo
Reo:	Inglês
I whakaputaina:	Elsevier 2023-07-01
Rangatū:	Journal of Materials Research and Technology
Ngā marau:	Polyimide Coordination interaction Thermal resistance Dimensional stability
Urunga tuihono:	http://www.sciencedirect.com/science/article/pii/S2238785423013133
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