Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties
Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were designed to obtain different Joule heating propertie...
שמור ב:
| Principais autores: | , , , , |
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| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
MDPI AG
2023-08-01
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| סדרה: | Metals |
| נושאים: | |
| גישה מקוונת: | https://www.mdpi.com/2075-4701/13/8/1475 |
| תגים: |
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