Thermal Interaction and Cooling of Electronic Device with Chiplet 2.5D Integration
With the development of artificial intelligence (AI) and high-performance computing (HPC), the microelectronic industry is challenged with increased device integration density. Chiplet architecture can break through a variety of limitations on the system-on-chip (SoC) to create a high-computility sy...
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| Autori principali: | , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
MDPI AG
2024-09-01
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| Serie: | Applied Sciences |
| Soggetti: | |
| Accesso online: | https://www.mdpi.com/2076-3417/14/18/8114 |
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