Design optimisation of air-forced heat sink to improve temperature gradient in power semiconductor modules
This paper presents a numerical optimisation of an air-forced heat sink design for application in cooling systems for power electronic devices. A three-phase inverter is a typical power electronic circuit which commonly employs three or six power semiconductor modules installed in a row on an air-fo...
保存先:
| 主要な著者: | , , , , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
Elsevier
2026-03-01
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| シリーズ: | Case Studies in Thermal Engineering |
| 主題: | |
| オンライン･アクセス: | http://www.sciencedirect.com/science/article/pii/S2214157X26001085 |
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