Electrochemical plating of Sn – Ag alloy applicable as a solder
The additions of hydroquinone, 1,4-butandiol and citrate ions to the known strongly acidic sulfate-thiourea solution for electrochemical deposition of Sn – Ag low-melting alloy are proposed, which provide to obtain the alloys of composition near to the eutectic one. It is shown that varying the cont...
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| Hlavní autoři: | , , , , , |
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| Médium: | Artigo |
| Jazyk: | Bielo-russo |
| Vydáno: |
Belarusian State University
2018-05-01
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| Edice: | Журнал Белорусского государственного университета: Химия |
| Témata: | |
| On-line přístup: | https://journals.bsu.by/index.php/chemistry/article/view/1225 |
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