Growth Kinetics of Ni₃Ga₇ in Ni/Ga System During Interfacial Reaction Diffusion

In order to apply Ga alloys to flexible and wearable electronic devices, it is crucial to verify the mechanical reliability of interconnections between Ga and various metal electrodes. This study investigated the phase transformation kinetics and microstructural evolution in the Ni/Ga couple. The di...

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Autori principali:	Jun Peng, Tao Wang, Shuai Zhang
Natura:	Artigo
Lingua:	Inglês
Pubblicazione:	MDPI AG 2025-05-01
Serie:	Crystals
Soggetti:	gallium intermetallic compound interfacial diffusion kinetics nickel
Accesso online:	https://www.mdpi.com/2073-4352/15/6/520
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