A DFT Characterization of Structural, Mechanical, and Thermodynamic Properties of Ag₉In₄ Binary Intermetallic Compound

The intermetallic compounds (IMCs) at the interface between the solder joint and metal bond pad/under bump metallization (UBM) exert a significant impact on the thermal–mechanical behavior of microelectronic packages because of their unique physical properties. In this study, a theoretical investiga...

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Autors principals:	Hsien-Chie Cheng, Ching-Feng Yu
Format:	Artigo
Idioma:	Inglês
Publicat:	MDPI AG 2022-10-01
Col·lecció:	Metals
Matèries:	intermetallic compound ab initio calculations density functional theory structure-property mechanical properties thermodynamic properties
Accés en línia:	https://www.mdpi.com/2075-4701/12/11/1852
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