Toward Flexible Printed Electronics: A Spider‐Silk‐Inspired, Strong and Tough Thermoplastic Polyamide Elastomer

ABSTRACT The advancement of intelligent and compliant flexible electronic devices demands polymer substrate materials that exhibit both high strength and toughness, which are critical for the performance and durability of printed circuits. Inspired by the structure of spider silk, we designed and sy...

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Bibliografische Detailangaben

Hauptverfasser:	Bo Yang, Liyue Zhang, Mengjing Yang, Hangzhi Guo, Zhibo Lin, Xinyu Qi, Wenjun Li, Haiyan Yan, Meng Li, Yanhui Chen, Weixing Chen, Zhenguo Liu, Wei Huang
Format:	Artigo
Sprache:	Inglês
Veröffentlicht:	Wiley 2026-06-01
Schriftenreihe:	Advanced Science
Schlagworte:	flexible printed electronics hierarchical structure hydrogen bond thermoplastic polyamide elastomer
Online-Zugang:	https://doi.org/10.1002/advs.75129
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