Atomic-Scale Mechanisms and Damage Suppression in Nanometric Cutting of Polycrystalline Copper: A Molecular Dynamics Study

Molecular dynamics simulations were performed to investigate the nanometric cutting of polycrystalline oxygen-free copper using a single-crystal diamond tool. The effects of grain size, tool geometry (rake angle and edge radius), cutting speed, and ambient temperature on atomic migration, dislocatio...

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Detalhes bibliográficos

Principais autores:	Yang Li, Peng Fu, Huan Gu, Shulin Liang, Lin Li, Hao Jiang, Yuan Hong, Zhan Li, Lei Lu, Rongrong Tang, Zhuo Li, Liqi Li
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2026-05-01
Colecção:	Nanomaterials
Assuntos:	polycrystalline copper molecular dynamics simulation nanometric cutting subsurface damage diamond tool wear
Acesso em linha:	https://www.mdpi.com/2079-4991/16/9/564
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