A Novel Out-of-Control Action Plan (OCAP) for Optimizing Efficiency and Quality in the Wafer Probing Process for Semiconductor Manufacturing

The out-of-control action plan (OCAP) is crucial in the wafer probing process of semiconductor manufacturing as it systematically addresses and corrects deviations, ensuring the high quality and reliability of semiconductor devices. However, the traditional OCAP involves many redundant and complicat...

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Principais autores:	Woonyoung Yeo, Yung-Chia Chang, Liang-Ching Chen, Kuei-Hu Chang
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2024-08-01
coleção:	Sensors
Assuntos:	out-of-control action plan (OCAP) wafer probing process semiconductor manufacturing probe test yield overall equipment effectiveness (OEE)
Acesso em linha:	https://www.mdpi.com/1424-8220/24/16/5116
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