Thermal Analysis of Ultimately-Thinned-and-Transfer-Bonded CMOS on Mechanically Flexible Foils

Thinned CMOS chips transfer-bonded onto a compliant host substrate remain to date the technology of choice for applications requiring both mechanical flexibility and high frequency operation. However, the use of poorly thermally conductive host substrates raises the problem of thermal management of...

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Autores principales:	Justine Philippe, Arun Bhaskar, Etienne Okada, Flavie Braud, Jean-Francois Robillard, Francois Danneville, Christine Raynaud, Daniel Gloria, Emmanuel Dubois
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	IEEE 2019-01-01
Colección:	IEEE Journal of the Electron Devices Society
Materias:	CMOS SOI thin film flexible electronics thermal management
Acceso en línea:	https://ieeexplore.ieee.org/document/8826282/
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