Improving bonding strength of W/Cu dual metal interface through laser micro-structuring method

Selective laser melting (SLM) is a promising technology for fabricating complex components with W/Cu dual metal. To enhance the interfacial bonding of W/Cu dual metal, we propose a novel approach using laser texturing to fabricate micro/nanostructures on the W surface. The micro/nanostructures promo...

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Bibliografische Detailangaben

Hauptverfasser:	Xing Li, Quanjie Wang, Libing Lu, Yingchun Guan, Wei Zhou
Format:	Artigo
Sprache:	Inglês
Veröffentlicht:	Light Publishing Group 2024-09-01
Schriftenreihe:	Light: Advanced Manufacturing
Schlagworte:	w/cu dual metal selective laser melting laser texturing mechanical interlocking tensile properties
Online-Zugang:	https://www.light-am.com/article/doi/10.37188/lam.2024.033
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