Estimation of Peak Junction Hotspot Temperature in Three-Level TNPC-IGBT Modules for Traction Inverters Through Chip-Level Modeling and Experimental Validation

Monitoring the peak junction hotspot temperature in IGBT modules is critical for ensuring the reliability of high-power industrial multilevel inverters, particularly when operating under extreme thermal conditions, such as in traction applications. This study presents a comprehensive chip-level anal...

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Hlavní autoři:	Ahmed H. Okilly, Peter Nkwocha Harmony, Cheolgyu Kim, Do-Wan Kim, Jeihoon Baek
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	MDPI AG 2025-07-01
Edice:	Energies
Témata:	three-level inverters IGBT modules chip-level loss modeling Foster thermal network critical case temperature peak junction hotspot temperature
On-line přístup:	https://www.mdpi.com/1996-1073/18/14/3829
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