Chip-Level 1 <formula formulatype="inline"><tex Notation="TeX">$\times$</tex></formula> 2 Optical Interconnects Using Polymer Vertical Splitter on Silicon Substrate

The chip-level 1 &#x00D7; 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 &#x00D7; 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 ^&#x00B0; reflectors. The high-fre...

Täydet tiedot

Bibliografiset tiedot

Päätekijät:	Chin-Ta Chen, Po-Kuan Shen, Teng-Zhang Zhu, Chia-Chi Chang, Shu-Shuan Lin, Mao-Yuan Zeng, Chien-Yu Chiu, Hsu-Liang Hsiao, Hsiao-Chin Lan, Yun-Chih Lee, Yo-Shen Lin, Mount-Learn Wu
Aineistotyyppi:	Artigo
Kieli:	Inglês
Julkaistu:	IEEE 2014-01-01
Sarja:	IEEE Photonics Journal
Aiheet:	Optical waveguides micromirrors silicon substrate optical interconnection
Linkit:	https://ieeexplore.ieee.org/document/6746668/
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