Electrical discharge machining of semiconductor materials: A review
Semiconductor materials including Silicon (Si), Germanium (Ge), Gallium Arsenide (GaAs), and Silicon Carbide (SiC) are difficult to machine due to their high brittleness and low plasticity. Conventional machining methods such as dicing and blade cutting used to cause quality problems such as cracks,...
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| 主要な著者: | , , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
Elsevier
2023-07-01
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| シリーズ: | Journal of Materials Research and Technology |
| 主題: | |
| オンライン･アクセス: | http://www.sciencedirect.com/science/article/pii/S2238785423014503 |
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