A Multi-Beam Phased Array Receiver Front-End with High Performance Ceramic SiP
This paper presents a compact four-beam dual-polarized phased array with the high performance front-end module based on system-in-package (SiP) technology. By employing high-temperature co-fired ceramic (HTCC) substrates, the proposed design achieves efficient thermal management and high level of in...
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| 主要な著者: | , , , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
MDPI AG
2026-01-01
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| シリーズ: | Micromachines |
| 主題: | |
| オンライン･アクセス: | https://www.mdpi.com/2072-666X/17/1/110 |
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