Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy

The evolution of the microstructure and grain orientation of metallic alloys during plastic deformation and recrystallization is of particular interest because these characteristics are known to strongly affect their mechanical properties and corrosion resistance. In this work, the hypoeutectic Al-4...

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Principais autores:	J.C. Lourenço, L.P. Souza, G. Silva, P.A. Suzuki, A.L.M. Robin, C.A. Nunes, C.R. Tomachuk
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Elsevier 2021-10-01
Colecção:	International Journal of Electrochemical Science
Assuntos:	Al-Cu alloy solidification swaging microstructure texture
Acesso em linha:	http://www.sciencedirect.com/science/article/pii/S145239812303568X
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