Additively manufacturing printed circuit boards with low waste footprint by transferring electroplated zinc tracks
Abstract Recyclable, degradable and printed electronics are gaining attention as solutions to the growing e-waste problem, but achieving high-resolution, high conductivity circuits with low end-of-life waste footprint remains difficult. Here we show the demonstration of a Printed Circuit Board Assem...
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| Principais autores: | , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Portfolio
2025-12-01
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| coleção: | Communications Materials |
| Acesso em linha: | https://doi.org/10.1038/s43246-025-01031-7 |
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