Numerical analysis of heat transfer and fluid flow in microchannel heat sinks for thermal management
Electronic components used in a variety of applications, such as electronic devices, computers, automobiles, medical equipment, telecommunications, etc., can be effectively cooled using microchannel heat sinks (MHS). In this paper, a novel design of an MHS is presented, which can manage the heat loa...
שמור ב:
| Principais autores: | , , , , , , , , |
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| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
Elsevier
2023-05-01
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| סדרה: | Case Studies in Thermal Engineering |
| נושאים: | |
| גישה מקוונת: | http://www.sciencedirect.com/science/article/pii/S2214157X23002708 |
| תגים: |
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