Initial Stages of Electrocrystallization of Coatings with Tin and Tin-Copper and Tin-Copper-Ultradisperse Diamond Alloys
The need of modern microelectronics in the development of technological processes for the formation of nanostructured layers puts forward the necessity of understanding the mechanisms of nucleation and growth of deposits. The article considers the features of the initial stages of electrocrystalliza...
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| Autors principals: | , , |
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| Format: | Artigo |
| Idioma: | Russo |
| Publicat: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2024-10-01
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| Col·lecció: | Доклады Белорусского государственного университета информатики и радиоэлектроники |
| Matèries: | |
| Accés en línia: | https://doklady.bsuir.by/jour/article/view/3978 |
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