Low Temperature Sealing Process and Properties of Kovar Alloy to DM305 Electronic Glass
The low temperature sealing of Kovar alloy to DM305 electronic glass was realized by using lead-free glass solder of the Bi<sub>2</sub>O<sub>3</sub>-ZnO-B<sub>2</sub>O<sub>3</sub> system in atmospheric environment. The sealing process was optimized by pre-oxidation of Kovar alloy and low temperature...
Gorde:
| Egile Nagusiak: | , , , , |
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| Formatua: | Artigo |
| Hizkuntza: | Inglês |
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MDPI AG
2020-07-01
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| Saila: | Metals |
| Gaiak: | |
| Sarrera elektronikoa: | https://www.mdpi.com/2075-4701/10/7/941 |
| Etiketak: |
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