Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip
The preparation method of integrated circuit lead frames has transitioned from stamping to etching, rendering them more sensitive to residual stress. Consequently, the dimensional deviations caused by residual stress become more pronounced, necessitating a thorough investigation into the copper stri...
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| Автори: | , , , , , |
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| Формат: | Artigo |
| Мова: | Inglês |
| Опубліковано: |
MDPI AG
2024-04-01
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| Серія: | Metals |
| Предмети: | |
| Онлайн доступ: | https://www.mdpi.com/2075-4701/14/5/491 |
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