Experimental evaluation method of curing condition and shrinkage for UV curing adhesive
The application of optical products using Laser or LED (Light Emitting Diode) spreads through industry and other fields, and the precise adhesive bonding technology becomes more important. In this paper, for the optimization of UV (Ultra Violet) curing adhesive bonding using UV Lamp or UV LED irradi...
שמור ב:
| מחבר ראשי: | |
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| פורמט: | Artigo |
| שפה: | Japonês |
| יצא לאור: |
The Japan Society of Mechanical Engineers
2021-04-01
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| סדרה: | Nihon Kikai Gakkai ronbunshu |
| נושאים: | |
| גישה מקוונת: | https://www.jstage.jst.go.jp/article/transjsme/87/897/87_20-00344/_pdf/-char/en |
| תגים: |
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