SMT Assembly Inspection Using Dual-Stream Convolutional Networks and Two Solder Regions

The automated optical inspection of a surface mount technology line inspects a printed circuit board for quality assurance, and subsequently classifies the chip assembly defects. However, it is difficult to improve the accuracy of previous defect classification methods using full chip component imag...

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Detalhes bibliográficos

Principais autores:	Young-Gyu Kim, Tae-Hyoung Park
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2020-07-01
Colecção:	Applied Sciences
Assuntos:	automated optical inspection defect classification convolutional neural network
Acesso em linha:	https://www.mdpi.com/2076-3417/10/13/4598
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