Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature
Landslides are a global and frequent natural hazard, affecting many communities and infrastructure networks. Technological solutions are needed for long-term, large-scale condition monitoring of infrastructure earthworks or natural slopes. However, current instruments for slope stability monitoring...
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| Główni autorzy: | , , , |
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| Format: | Artigo |
| Język: | Inglês |
| Wydane: |
MDPI AG
2022-04-01
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| Seria: | Sensors |
| Hasła przedmiotowe: | |
| Dostęp online: | https://www.mdpi.com/1424-8220/22/7/2814 |
| Etykiety: |
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